Sealing Business

R.Pororoca

Pororoca is AIR WATER MACH’s newest brand of O-rings for LCD and semiconductor manufacturing equipment. We are establishing a firm foothold in high-tech fields including the semiconductor industry to cope with severe chemical environments and requirements such as heat resistance, chemical resistance, and plasma resistance.

Features

  • Excellent heat resistance

    Through the adoption of a special FFKM polymer that features the highest heat resistance among rubber materials and the introduction of a new vulcanization system, we have developed a super heat-resistant grade (heat resistance standard of 350°C) material that can be used in high temperature processes.

  • Specialized for low particle and low outgassing

    Damage from plasma is reduced by mixing special filler in particle emission, which is the cause of decreased yield in semiconductor and FPD manufacturing processes. The series also includes grades that minimize emission gas leakage from sealing parts, which is another cause of decreased yield.

  • Extensive lineup

    With our long-standing manufacturing know-how and original formulating technology, we offer an extensive lineup that provides you with optimum materials suitable for a variety of applications. You may also increase cost performance with the support of products from our existing lineup.

  • Specialized for a variety of resistance properties (solvents, chemicals, low metal elution, low adhesion, etc.)

    In addition to grades with superior resistance to solvents and low metal elution, we can also provide a wide range of materials with resistance to various chemicals.

Lineup

You can choose materials according to your process requirements.

R.Pororoca am

  • Withstands use at ultra-high temperatures up to the R.Pororoca series maximum of 350°C
  • Excellent chemical resistance (use caution in amine / steam environments)

R.Pororoca 875B

  • Extensive chemical resistance (including amine, steam, and ozone)
  • Long-lasting sealing performance and excellent mechanical properties

R.Pororoca 251B

  • Balanced heat resistance / chemical resistance performance (Standard heat resistance: 320°C)

R.Pororoca 252W

  • Heat resistant, non-carbon material (Standard heat resistance: 300°C)

R.Pororoca G80C

  • Contains no metallic filler, providing excellent purity

R.Pororoca IOTA

  • General purpose fluororubber optimized for low outgassing performance

Seal Selection Guide for Semiconductor Use

Process Use / Device Recommended Material Material Characteristics
A)Lithography
Resist coating / development
  • Resist tube seal
  • Chemical line seal

    Coater & developer

875B
  • Excellent chemical resistance and mechanical properties
B)Etching / Ashing
Wet process
  • Chemical line seal

    Etching equipment

875B
  • Excellent chemical resistance and mechanical strength
Dry process
  • As a component inside the chamber
    Chamber lid seal
    Gate valve, etc.

    Plasma etching equipment

    Plasma ashing equipment

251B
252W
  • Excellent heat resistance and purity
  • Excellent heat resistance and mechanical properties
  • Excellent heat resistance and plasma resistance characteristics
  • Excellent plasma resistance and mechanical properties
C)Cleaning / Resist Separation
Resist stripping
  • Chemical line seal

    Resist stripping

  • Chemical line seal
  • Filter

    Cleaning equipment

875B
  • Excellent resistance to amine stripping solutions
  • Excellent chemical resistance and mechanical properties
Cleaning G80C
  • Excellent purity
  • Low extract
D)Oxidation / Diffusion
 
  • Furnace seal

    Oxidizing / diffusion furnace

    Lamp annealing equipment

am
251B
IOTA
  • Maximum resistance to heat (up to 350°C)
  • Excellent heat resistance and mechanical properties
  • Excellent low adhesion properties and high conductivity
  • Low gas emission
E)Electrode / Wiring
 
  • Chamber seal

    Sputtering equipment

    Metal CVD equipment

am
251B
  • Maximum resistance to heat (up to 350°C)
  • Excellent heat resistance and mechanical properties
F)Insulating Film Formation
 
  • Chamber seal

    (Plasma) CVD equipment

    LP-CVD equipment

IOTA
  • Excellent heat resistance and purity
  • Excellent low adhesion properties and high conductivity
  • Low gas emission
G)Polishing
Chemical/physical polishing
  • Chamber seal
  • Chemical line seal

    CMP equipment

875B
  • Excellent chemical resistance and mechanical properties
  • Low extract

Series Physical Properties List

Property name\Normal physical property Color Heat resistance
Hardness
Shore A
Tensile strength
MPa
100%
Tensile stress
MPa
Elongation
Compression set
JIS test specimen
200°C 70 h
Compression set
O-ring
200℃70H
Compression set
O-ring
300℃70H
Test conditions JIS
K6253
JIS K6251 JIS K6262
Compression ratio: 25%
O-ring:P25
Compression ratio: 25%
R.Pororoca
am
Black3507715.510.4150313
R.Pororoca
875B
Black2207516.56.31801218
R.Pororoca
251B
Black 32075218.7210161839
R.Pororoca
252W
White 30075187.12603363
R.Pororoca
G80C
Amber2208019.33.543054
R.Pororoca
IOTA
Black2207515.84.724610Outgas quantity at 200°C
9.0μg/g

Series Resistance List

  • [Usage]
  • +++:Recommended
  • ++:Applicable
  • +:Applicable depending on location
  • NR:Not recommended
Material name\Item Base polymer Recommended use
D:dry
W:wet
Heavy metal elution Heat-generated gas Chemical resistance Plasma resistance
Organic acids Inorganic acids Amine Solvents High concentration ozone Oxygen Halogen
R.Pororoca
am
FFKMD++++++++
R.Pororoca
875B
FFKMD/W+++++++++++++++++++++++
R.Pororoca
251B
FFKMD/W++++++++++++++++++++++
R.Pororoca
252W
FFKMD+++++++
R.Pororoca
G80C
FKMD++++++
R.Pororoca
IOTA
FKMD+++++