Sealing Business

Pororoca

Pororoca is AIR WATER MACH’s newest brand of O-rings for LCD and semiconductor manufacturing equipment. We are establishing a firm foothold in high-tech fields including the semiconductor industry to cope with severe chemical environments and requirements such as heat resistance, chemical resistance, and plasma resistance.

Features

Excellent heat resistance

Through the adoption of a special FFKM polymer that features the highest heat resistance among rubber materials and the introduction of a new vulcanization system, we have developed a super heat-resistant grade (heat resistance standard of 350°C) material that can be used in high temperature processes.
Specialized for low particle and low outgassing

Damage from plasma is reduced by mixing special filler in particle emission, which is the cause of decreased yield in semiconductor and FPD manufacturing processes. The series also includes grades that minimize emission gas leakage from sealing parts, which is another cause of decreased yield.
Extensive lineup

With our long-standing manufacturing know-how and original formulating technology, we offer an extensive lineup that provides you with optimum materials suitable for a variety of applications. You may also increase cost performance with the support of products from our existing lineup.
Specialized for a variety of resistance properties (solvents, chemicals, low metal elution, low adhesion, etc.)

In addition to grades with superior resistance to solvents and low metal elution, we can also provide a wide range of materials with resistance to various chemicals.

Lineup

You can choose materials according to your process requirements.

Pororoca am

Withstands use at ultra-high temperatures up to the Pororoca series maximum of 350°C
Excellent chemical resistance (use caution in amine / steam environments)

Pororoca 875B

Extensive chemical resistance (including amine, steam, and ozone)
Long-lasting sealing performance and excellent mechanical properties

Pororoca 251B

Balanced heat resistance / chemical resistance performance (Standard heat resistance: 320°C)

Pororoca 252W

Heat resistant, non-carbon material (Standard heat resistance: 300°C)

Pororoca cf

Heat resistant, low adhesion properties to metal (Standard heat resistance: 250°C)

Pororoca G80C

Contains no metallic filler, providing excellent purity

Pororoca IOTA

General purpose fluororubber optimized for low outgassing performance

Seal Selection Guide for Semiconductor Use

Process	Use / Device	Recommended Material	Material Characteristics
A）Lithography
Resist coating / development	Resist tube seal Chemical line seal Coater & developer	875B	Excellent chemical resistance
B）Etching / Ashing
Wet process	Chemical line seal Etching equipment	875B	Excellent chemical resistance
Dry process	As a component inside the chamber Chamber lid seal Gate valve, etc. Plasma etching equipment Plasma ashing equipment	251B 252W	Excellent heat resistance and plasma resistance characteristics
C）Cleaning / Resist Separation
Resist stripping	Chemical line seal Resist stripping Chemical line seal Filter Cleaning equipment	875B	Excellent chemical resistance
Cleaning		G80C	Excellent purity
D）Oxidation / Diffusion
	Furnace seal Oxidizing / diffusion furnace Lamp annealing equipment	am 251B cf	Excellent heat resistance Low gas emission
E）Electrode / Wiring
	Chamber seal Sputtering equipment Metal CVD equipment	am 251B	Excellent heat resistance
F）Insulating Film Formation
	Chamber seal (Plasma) CVD equipment LP-CVD equipment	IOTA	Excellent heat resistance Low gas emission
G）Polishing
Chemical/physical polishing	Chamber seal Chemical line seal CMP equipment	875B	Excellent chemical resistance

Series Physical Properties List

Property name\Normal physical property	Color	Heat resistance ℃	Hardness Shore A	Tensile strength MPa	100％ Tensile stress MPa	Elongation ％	Compression set JIS test specimen 200°C 70 h ％	Compression set O-ring 200℃70H ％	Compression set O-ring 250℃70H ％	Compression set O-ring 300℃70H ％	Outgas quantity 200℃ μg/g
Test conditions	－	－	JIS K6253	JIS K6251			JIS K6262 Compression ratio: 25％	O-ring：P25 Compression ratio: 25％			－
Pororoca am	Black	350	77	15.5	10.4	150	－	3	－	13	－
Pororoca 875B	Black	220	75	16.5	6.3	180	12	18	－	－	－
Pororoca 251B	Black	320	75	21	8.7	210	16	18	－	39	－
Pororoca 252W	White	300	75	18	7.1	260	－	33	－	63	－
Pororoca G80C	Amber	220	80	19.3	3.5	430	－	54	－	－	－
Pororoca IOTA	Black	220	75	15.8	4.7	246	10	－	－	－	9.0
Pororoca cf	Black	250	75	14.1	7.4	200	9	－	24	－	－

Series Resistance List

[Usage]
+++：Recommended
++：Applicable
+：Applicable depending on location
NR：Not recommended

Material name＼Item	Base polymer	Recommended use D：dry W：wet	Heavy metal elution	Heat-generated gas	Chemical resistance					Plasma resistance
Material name＼Item	Base polymer	Recommended use D：dry W：wet	Heavy metal elution	Heat-generated gas	Organic acids	Inorganic acids	Amine	Solvents	High concentration ozone	Oxygen	Halogen
Pororoca am	FFKM	D	++	++	－	－	－	－	－	++	++
Pororoca 875B	FFKM	D/W	++	++	+++	+++	+++	+++	+++	++	++
Pororoca 251B	FFKM	D/W	+	++	+++	+++	+++	+++	+++	++	++
Pororoca 252W	FFKM	D	－	++	－	－	－	－	－	++	+++
Pororoca G80C	FKM	D	+++	+	－	－	－	－	－	+	+
Pororoca IOTA	FKM	D	－	+++	－	－	－	－	－	+	+
Pororoca cf	FKM	D	－	++	－	－	－	－	－	－	－

Sealing Business Technology